WANWEI DLP 2000

[Introduction]

WANWEI Latex Powder (DLP) 2000 redispersible polymer powder is a free-flowing, white powder obtained by spray drying of an aqueous vinyl acetate-ethylene copolymer dispersion. It offers all the advantages of a free-flowing powder additive, such as ease of transportation, storage and handling. DLP 2000 can be used in a variety of applications in the construction industry to improve key properties of cement- and gypsum-based formulations. It is highly recommended for building products exposed to conditions of thermal or mechanical stress. It has especially been developed for cement-based tile adhesives meeting the EN12004 standard.

[Benefits]

• Application versatility

• Improves workability

• Improves tensile, compression and flexural strength

• Improves transversal deformation

• Yields excellent cost-performance ratio in cement-based tile adhesives, according to EN12004

• Excellent impact resistance

• Helps reduce formation of cracks caused by shrinkage

[Physical Properties]

Appearance White, free- flowing powder
Polymer Base Vinyl acetate-ethylene copolymer
Residual moisture, max % 2
Bulk density, g/mL 0.375 – 0.525
Ash content. % 10-14
Redispersion (50% solids)
(MFFT), °C 3
pH 5.0 – 7.0

[Applications]

• Cement based tile adhesives

• Adhesion mortars

• Repair mortars

• Renders

• Gypsum joint fillers

• Crack fillers

[Handling & Storage]

DLP 2000 is a free-flowing powder, and as such can create dust. Avoid dust buildup. Fine dust of this product can form weakly explosive mixtures with air and could pose a fire and explosion hazard; keep away from ignition sources. Take precautions to avoid accumulation of static charge. Practice care and caution to avoid explosive conditions.

DLP 2000 redispersible polymer powder should be stored in a dry and cool environment. It is recommended to be used within six months. Storage in high humidity and temperature will increase the risk of blocking. Storage under pressure should also be avoided. Do not stack pallets on top of each other.